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HI-506, HI-507, HI-508, HI-509
Data Sheet June 1999 File Number
3142.2
Single 16 and 8/Differential 8-Channel and 4-Channel CMOS Analog Multiplexers
The HI-506/HI-507 and HI-508/HI-509 monolithic CMOS multiplexers each include an array of sixteen and eight analog switches respectively, a digital decoder circuit for channel selection, voltage reference for logic thresholds, and an enable input for device selection when several multiplexers are present. The Dielectric Isolation (DI) process used in fabrication of these devices eliminates the problem of latchup. DI also offers much lower substrate leakage and parasitic capacitance than conventional junction isolated CMOS (see Application Notes AN520 and AN521). The switching threshold for each digital input is established by an internal +5V reference, providing a guaranteed minimum 2.4V for logic "1" and maximum 0.8V for logic "0". This allows direct interface without pullup resistors to signals from most logic families: CMOS, TTL, DTL and some PMOS. For protection against transient overvoltage, the digital inputs include a series 200 resistor and diode clamp to each supply. The HI-506 is a single 16-Channel, the HI-507 is an 8-Channel differential, the HI-508 is a single 8-Channel and the HI-509 is a 4-Channel differential multiplexer. If input overvoltages are present, the HI-546/HI-547/HI-548/ HI-549 multiplexers are recommended.
Features
* Low ON Resistance . . . . . . . . . . . . . . . . . . . . . . . . . 180 * Wide Analog Signal Range . . . . . . . . . . . . . . . . . . . . . 15V * TTL/CMOS Compatible * Access Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250ns * Maximum Power Supply . . . . . . . . . . . . . . . . . . . . . . . .44V * Break-Before-Make Switching * No Latch-Up * Replaces DG506A/DG506AA and DG507A/DG507AA * Replaces DG508A/DG508AA and DG509A/DG509AA
Applications
* Data Acquisition Systems * Precision Instrumentation * Demultiplexing * Selector Switch
Ordering Information
PART NUMBER HI9P0506-9 HI3-0506-5 HI4P0506-5 HI1-0506-5 HI1-0506-4 HI1-0506-2 HI4P0507-5 HI3-0507-5 HI1-0507-2 HI1-0508-5 HI3-0508-5 HI1-0508-4 HI1-0508-2 HI4P0508-5 HI9P0508-9 HI9P0508-5 HI9P0509-5 HI1-0509-4 HI1-0509-5 HI3-0509-5 HI4P0509-5 HI1-0509-2 TEMP. RANGE (oC) -40 to 85 0 to 75 0 to 75 0 to 75 -25 to 85 -55 to 125 0 to 75 0 to 75 -55 to 125 0 to 75 0 to 75 -25 to 85 -55 to 125 0 to 75 -40 to 85 0 to 75 0 to 75 -25 to 85 0 to 75 0 to 75 0 to 75 -55 to 125 PACKAGE 28 Ld SOIC 28 Ld PDIP 28 Ld PLCC 28 Ld CERDIP 28 Ld CERDIP 28 Ld CERDIP 28 Ld PLCC 28 Ld PDIP 28 Ld CERDIP 16 Ld CERDIP 16 Ld PDIP 16 Ld CERDIP 16 Ld CERDIP 20 Ld PLCC 16 Ld SOIC 16 Ld SOIC 16 Ld SOIC 16 Ld CERDIP 16 Ld CERDIP 16 Ld PDIP 20 Ld PLCC 16 Ld CERDIP PKG. NO. M28.3 E28.6 N28.45 F28.6 F28.6 F28.6 N28.45 E28.6 F28.6 F16.3 E16.3 F16.3 F16.3 N20.35 M16.15 M16.15 M16.15 F16.3 F16.3 E16.3 N20.35 F16.3
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright (c) Intersil Corporation 1999
HI-506, HI-507, HI-508, HI-509 Pinouts
HI-506 (PDIP, CERDIP, SOIC) TOP VIEW
+VSUPPLY 1 NC 2 NC 3 IN 16 4 IN 15 5 IN 14 6 IN 13 7 IN 12 8 IN 11 9 IN 10 10 IN 9 11 GND 12 NC 13 ADDRESS A3 14 28 OUT 27 -VSUPPLY 26 IN 8 25 IN 7 24 IN 6 23 IN 5 22 IN 4 21 IN 3 20 IN 2 19 IN 1 18 ENABLE 17 ADDRESS A0 16 ADDRESS A1 15 ADDRESS A2 +VSUPPLY 1 OUT B 2 NC 3 IN 8B 4 IN 7B 5 IN 6B 6 IN 5B 7 IN 4B 8 IN 3B 9 IN 2B 10 IN 1B 11 GND 12 NC 13 NC 14
HI-507 (PDIP, CERDIP) TOP VIEW
28 OUT A 27 -VSUPPLY 26 IN 8A 25 IN 7A 24 IN 6A 23 IN 5A 22 IN 4A 21 IN 3A 20 IN 2A 19 IN 1A 18 ENABLE 17 ADDRESS A0 16 ADDRESS A1 15 ADDRESS A2
HI-506 (PLCC) TOP VIEW
+VSUPPLY -VSUPPLY
HI-507 (PLCC) TOP VIEW
+VSUPPLY -VSUPPLY 27 OUT B OUT A
IN 8B
4 IN 15 IN 14 IN 13 IN 12 IN 11 IN 10 IN 9 5 6 7 8 9 10 11 12 GND
3
2
1
28
27
26 25 24 23 22 21 20 19 IN 7 IN 6 IN 5 IN 4 IN 3 IN 2 IN 1 IN 7B IN 6B IN 5B IN 4B IN 3B IN 2B IN 1B 5 6 7 8 9 10 11
4
3
2
1
28
IN 8A 26 25 24 23 22 21 20 19 IN 7A IN 6A IN 5A IN 4A IN 3A IN 2A IN 1A 18 ENABLE
IN 16
OUT
IN 8
NC
NC
13 NC
14 A3
15 A2
16 A1
17 A0
18 ENABLE
12 GND
13 NC
NC
14 NC
15 A2
16 A1
17 A0
2
HI-506, HI-507, HI-508, HI-509 Pinouts
(Continued) HI-508 (PDIP, CERDIP, SOIC) TOP VIEW
A0 1 ENABLE 2 -VSUPPLY 3 IN 1 4 IN 2 5 IN 3 6 IN 4 7 OUT 8 16 A1 15 A2 14 GND 13 +VSUPPLY 12 IN 5 11 IN 6 10 IN 7 9 IN 8
HI-509 (PDIP, CERDIP, SOIC) TOP VIEW
A0 1 ENABLE 2 -VSUPPLY 3 IN 1A 4 IN 2A 5 IN 3A 6 IN 4A 7 OUT A 8 16 A1 15 GND 14 +VSUPPLY 13 IN 1B 12 IN 2B 11 IN 3B 10 IN 4B 9 OUT B
HI-508 (PLCC) TOP VIEW
ENABLE ENABLE
HI-509 (PLCC) TOP VIEW
NC
A0
A1
3 -VSUPPLY IN 1 NC IN 2 IN 3 4 5 6 7 8 9 IN 4
2
1
20
19 18 GND 17 +VSUPPLY 16 NC 15 IN 5 14 IN 6 -VSUPPLY IN 1A NC IN 2A IN 3A 4 5 6 7 8
A2
3
2
1
20
19 18 +VSUPPLY 17 IN 1B 16 NC 15 IN 2B 14 IN 3B
10 OUT
11 NC
12 IN 8
13 IN 7
9 IN 4A
10 OUT A
11 NC
12 OUT B
13 IN 4B
3
GND
NC
A0
A1
HI-506, HI-507, HI-508, HI-509 Truth Tables
HI-506 A3 X L L L L L L L L H H H H H H H H A2 X L L L L H H H H L L L L H H H H A1 X L L H H L L H H L L H H L L H H A0 X L H L H L H L H L H L H L H L H HI-507 A2 X L L L L H H H H A1 X L L H H L L H H A0 X L H L H L H L H EN L H H H H H H H H "ON" CHANNEL None 1 2 3 4 5 6 7 8 EN L H H H H H H H H H H H H H H H H "ON" CHANNEL None 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A1 X L L H H A0 X L H L H EN L H H H H A2 X L L L L H H H H A1 X L L H H L L H H A0 X L H L H L H L H HI-508 EN L H H H H H H H H HI-509 "ON" CHANNEL PAIR None 1 2 3 4 "ON" CHANNEL None 1 2 3 4 5 6 7 8
4
HI-506, HI-507, HI-508, HI-509 Functional Diagrams
HI-506 HI-507
IN 1 IN 2 DECODER/ DRIVER IN 16
OUT
IN 1A
OUT A
IN 8A IN 1B OUT B
DECODER/ DRIVER IN 8B 5V REF LEVEL SHIFT 5V REF LEVEL SHIFT
DIGITAL
INPUT PROTECTION

A0 A1 A2 A3
EN
DIGITAL
INPUT PROTECTION
A0
A1
A2
EN
HI-508
HI-509
IN 1 IN 2 DECODER/ DRIVER IN 8
OUT
IN 1A
OUT A
IN 4A IN 1B OUT B
DECODER/ DRIVER IN 4B 5V REF LEVEL SHIFT 5V REF LEVEL SHIFT
DIGITAL
INPUT PROTECTION
A0
A1
A2
EN
DIGITAL
INPUT PROTECTION
A0
A1
EN
5
HI-506, HI-507, HI-508, HI-509 Schematic Diagrams
ADDRESS DECODER
V+ P P P P P P P
N A0 OR A0 A1 OR A1
N
N
TO P-CHANNEL DEVICE OF THE SWITCH
N
N
A2 OR A2
TO N-CHANNEL DEVICE OF THE SWITCH
N
A3 OR A3
N
ENABLE DELETE A3 OR A3 INPUT FOR HI-507, HI-508, HI-509 DELETE A2 OR A2 INPUT FOR HI-509
V-
ADDRESS INPUT BUFFER LEVEL SHIFTER
P3 P1 V+ D1 N1 P4 V+
P5 A P6 P7 P8 P9 P10
D2 200 VAIN
VL VR P2 N4 N2 N3 VN5
N6
N7
N8
N9
N10
A
ALL N-CHANNEL BODIES TO VALL P-CHANNEL BODIES TO V+ UNLESS OTHERWISE INDICATED
TTL REFERENCE CIRCUIT
V+ P15 Q1P Q2P Q3P Q4P FROM DECODE
MULTIPLEX SWITCH
N18
Q5N V+ Q6N R2 16.8K Q11P Q10N Q9P N13 N14 N15 Q12N FROM DECODE VGND D3 R3 6.8K P16 VR P18 Q7P VQ8N IN P17 N19 N17 OUT
VL
N12
6
HI-506, HI-507, HI-508, HI-509
Absolute Maximum Ratings
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +44V V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +22V V- to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25V Digital Input Voltage (VEN , VA) . . . . . (V-) -4V to (V+) +4V or 20mA, Whichever Occurs First Analog Signal (VIN, VOUT, Note 2) . . . . . . . . . . (V-) -2V to (V+) +2V Continuous Current, In or Out . . . . . . . . . . . . . . . . . . . . . . . . . 20mA Peak Current, In or Out (Pulsed 1ms, 10% Duty Cycle Max) . 40mA
Thermal Information
Thermal Resistance (Typical, Note 1) JA (oC/W) JC (oC/W) 16 Ld CERDIP Package. . . . . . . . . . . . 85 32 16 Ld SOIC Package . . . . . . . . . . . . . . 115 N/A 16 Ld PDIP Package . . . . . . . . . . . . . . 100 N/A 20 Ld PLCC Package. . . . . . . . . . . . . . 80 N/A 28 Ld CERDIP Package. . . . . . . . . . . . 55 18 28 Ld PDIP Package . . . . . . . . . . . . . . 60 N/A 28 Ld SOIC Package . . . . . . . . . . . . . . 70 N/A 28 Ld PLCC Package. . . . . . . . . . . . . . 70 N/A Maximum Junction Temperature Ceramic Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .175oC Plastic Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC (SOIC and PLCC - Lead Tips Only)
Operating Conditions
Temperature Ranges HI-506/507/508/509-2 . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC HI-506/508/509-4 . . . . . . . . . . . . . . . . . . . . . . . . . . -25oC to 85oC HI-506/507/508/509-5 . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 75oC HI-506/508-9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES: 1. JA is measured with the component mounted on an evaluation PC board in free air. 2. Signals on IN or OUT exceeding V+ or V- are clamped by internal diodes. Limit resulting current to maximum current ratings. If an overvoltage condition is anticipated (analog input exceeds either power supply voltage), the Harris HI-546/HI-547/HI-548/HI-549 multiplexers are recommended.
Electrical Specifications
Supplies = +15V, -15V; VAH (Logic Level High) = 2.4V; VAL (Logic Level Low) = 0.8V, Unless Otherwise Specified. For Test Conditions, Consult Test Circuits Section TEST CONDITIONS TEMP (oC) -2 MIN TYP MAX MIN -4, -5, -9 TYP MAX UNITS
PARAMETER DYNAMIC CHARACTERISTICS Access Time, tA
25 Full
25 50 -
250 80 250 250 1.2 2.4 360 600 68 10
500 1000 500 1000 500 1000 -
25 50 -
250 80 250 250 1.2 2.4 360 600 68 10
1000 1000 1000 -
ns ns ns ns ns ns ns s s ns ns dB pF
Break-Before-Make Delay, tOPEN Enable Delay (ON), tON(EN)
25 25 Full
Enable Delay (OFF), tOFF(EN)
25 Full
Settling Time, tS (HI-506 and HI-507) Settling Time, tS (HI-508 and HI-509) Off Isolation Channel Input Capacitance, CS(OFF) Channel Output Capacitance, CD(OFF) HI-506 HI-507 HI-508 HI-509 Digital Input Capacitance, CA Input to Output Capacitance, CDS(OFF)
To 0.1% To 0.01% To 0.1% To 0.01% Note 6
25 25 25 25 25 25
25 25 25 25 25 25
-
52 30 17 12 6 0.08
-
-
52 30 17 12 6 0.08
-
pF pF pF pF pF pF
7
HI-506, HI-507, HI-508, HI-509
Electrical Specifications
Supplies = +15V, -15V; VAH (Logic Level High) = 2.4V; VAL (Logic Level Low) = 0.8V, Unless Otherwise Specified. For Test Conditions, Consult Test Circuits Section (Continued) TEST CONDITIONS TEMP (oC) -2 MIN TYP MAX MIN -4, -5, -9 TYP MAX UNITS
PARAMETER DIGITAL INPUT CHARACTERISTICS Input Low Threshold, VAL Input High Threshold, VAH Input Leakage Current (High or Low), IA ANALOG CHANNEL CHARACTERISTICS Analog Signal Range, VIN On Resistance, rON rON , (Any Two Channels) Off Input Leakage Current, IS(OFF)
Full Full Note 5 Full
2.4 -
-
0.8 1.0
2.4 -
-
0.8 1.0
V V A
Full Note 3 25 25 Note 4 25 Full
-15 -
180 5 0.03 0.3 0.3 -
+15 300 50 300 200 200 100 300 200 200 100 50
-15 -
180 5 0.03 0.3 0.3 -
+15 400 50 300 200 200 100 300 200 200 100 50
V % nA nA nA nA nA nA nA nA nA nA nA nA nA
Off Output Leakage Current, ID(OFF) HI-506 HI-507 HI-508 HI-509 On Channel Leakage Current, ID(ON) HI-506 HI-507 HI-508 HI-509 Differential Off Output Leakage Current, IDIFF (HI-507, HI-509 Only) POWER SUPPLY CHARACTERISTICS Current, I+ HI-506/HI-507 HI-508/HI-509 Current, IHI-506/HI-507 HI-508/HI-509 Power Dissipation, PD HI-506/HI-507 HI-508/HI-509 NOTES: 3. VOUT = 10V, IOUT = +1mA.
Note 4
25 Full Full Full Full
Note 4
25 Full Full Full Full Full
Note 7 Note 7
Full Full
-
1.5 1.5
3.0 2.4
-
1.5 1.5
3.0 2.4
mA mA
Note 7 Note 7
Full Full
-
0.4 0.4
1.0 1.0
-
0.4 0.4
1.0 1.0
mA mA
Full Full
-
-
60 51
-
-
60 51
mW mW
4. 10nA is the practical lower limit for high speed measurement in the production test environment. 5. Digital input leakage is primarily due to the clamp diodes (see Schematic). Typical leakage is less than 1nA at 25oC. 6. VEN = 0.8V, RL = 1K, CL = 15pF, VS = 7VRMS , f = 100kHz. 7. VEN , VA = 0V or 2.4V.
8
HI-506, HI-507, HI-508, HI-509 Test Circuits and Waveforms
TA = 25oC, VSUPPLY = 15V, VAH = 2.4V, VAL = 0.8V, Unless Otherwise Specified
1mA
V2
IN
OUT V2 1mA
VIN
rON =
FIGURE 1A. TEST CIRCUIT
400 NORMALIZED RESISTANCE (REFERRED TO VALUE AT 15V)
2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 -10 -5 0 5 ANALOG INPUT (V) 10 15 7 8 9 10 11 12 13 14 15 SUPPLY VOLTAGE (V) -55oC TO 125oC VIN = 0V
ON RESISTANCE ()
300 125oC 200 25oC
100
-55oC
0 -15
FIGURE 1B. ON RESISTANCE vs ANALOG INPUT VOLTAGE
FIGURE 1C. NORMALIZED ON RESISTANCE vs SUPPLY VOLTAGE
FIGURE 1. ON RESISTANCE
100nA
10nA LEAKAGE CURRENT
OFF OUTPUT LEAKAGE CURRENT ID(OFF) ID(ON) EN OUT 0.8V
1nA
A
ID(OFF)
10V 100pA OFF INPUT LEAKAGE CURRENT IS(OFF)
+10V
10pA 25 50 75 100 125 TEMPERATURE (oC)
FIGURE 2A. LEAKAGE CURRENT vs TEMPERATURE
FIGURE 2B. ID(OFF) TEST CIRCUIT (NOTE 8)
9
HI-506, HI-507, HI-508, HI-509 Test Circuits and Waveforms
TA = 25oC, VSUPPLY = 15V, VAH = 2.4V, VAL = 0.8V, Unless Otherwise Specified (Continued)
OUT A IS(OFF) EN +10V 10V +10V 0.8V A0 A1 EN
OUT A ID(ON)
10V
2.4V
FIGURE 2C. IS(OFF) TEST CIRCUIT (NOTE 8) FIGURE 2D. ID(ON) TEST CIRCUIT (NOTE 8) FIGURE 2. LEAKAGE CURRENTS NOTE: 8. Two measurements per channel: 10V and +10V. (Two measurements per device for ID(OFF) 10V and +10V)
70 60 SWITCH CURRENT (mA) 50 25oC 40 30 20 10 0 125oC VIN A -55oC
0
2
4 6 8 10 12 VOLTAGE ACROSS SWITCH (V)
14
16
FIGURE 3A. ON CHANNEL CURRENT vs VOLTAGE FIGURE 3. ON CHANNEL CURRENT
FIGURE 3B. TEST CIRCUIT
+15V/+10V 8 VSUPPLY = 15V SUPPLY CURRENT (mA) 6 V+ IN 1 HI-506 A2 IN 2 THRU A1 IN 7/15 A3 A0 2 VSUPPLY = 10V 0 1K 10K 100K TOGGLE FREQUENCY (Hz) 1M 10M VA 3.5V EN GND IN 8/16 OUT V10V/5V A +ISUPPLY
4
VA
50
+10V/+5V
14 pF
HIGH = 3.5V LOW = 0V 50% DUTY CYCLE
10 M
Similar connection for HI-507/HI-508/
HI-509
A
-ISUPPLY -15V/-10V
FIGURE 4A. SUPPLY CURRENT vs TOGGLE FREQUENCY FIGURE 4. DYNAMIC SUPPLY CURRENT
FIGURE 4B. TEST CIRCUIT
10
HI-506, HI-507, HI-508, HI-509 Test Circuits and Waveforms
TA = 25oC, VSUPPLY = 15V, VAH = 2.4V, VAL = 0.8V, Unless Otherwise Specified (Continued)
+15V
600 A3 ACCESS TIME (ns) A2 400 VA 50 A1 A0 3.5V 200 EN GND
V+ IN 1 IN 2 THRU IN 7/15 HI-506 IN 16 OUT V-
10V
+10V
10 k
50 pF
-15V 0 2 3 4 5 13 LOGIC LEVEL (HIGH) (V) 14 15
Similar connection for HI-507/HI-508/
HI-509
FIGURE 5A. ACCESS TIME vs LOGIC LEVEL (HIGH)
FIGURE 5B. TEST CIRCUIT
3.5V 50%
ADDRESS DRIVE (VA) 0V
VA INPUT 2V/DIV. S1 ON
+10V OUTPUT 10% tA S16 ON 200ns/DIV. -10V OUTPUT 5V/DIV.
FIGURE 5C. MEASUREMENT POINTS FIGURE 5. ACCESS TIME
FIGURE 5D. WAVEFORMS
+15V
A3 A2
V+ HI-506 +5V IN 1
VA
50
A1 A0
IN 2 THRU IN 7/IN 15 IN 8 /16 VOUT GND OUT V200 50pF
3.5V
EN
-15V
Similar connection for HI-507/HI-508/HI-509
FIGURE 6A. TEST CIRCUIT
11
HI-506, HI-507, HI-508, HI-509 Test Circuits and Waveforms
TA = 25oC, VSUPPLY = 15V, VAH = 2.4V, VAL = 0.8V, Unless Otherwise Specified (Continued)
3.5V
VA INPUT 2V/DIV. ADDRESS DRIVE (VA) OUTPUT S1 ON S16 ON
0V
OUTPUT 1V/DIV.
50%
50%
tOPEN 100ns/DIV.
FIGURE 6B. MEASUREMENT POINTS FIGURE 6. BREAK-BEFORE-MAKE DELAY
+15V
FIGURE 6C. WAVEFORMS
A3 A2
V+ HI-506 IN 1 +10V
A1 A0 EN VA 50
IN 2 THRU IN 7/IN 15 IN 8 /16 VOUT GND OUT V200 50pF
-15V
Similar connection for HI-507/HI-508/HI-509
FIGURE 7A. TEST CIRCUIT
3.5V 50% 50% ENABLE DRIVE (VA) 0V OUTPUT 10% 0V tON(EN) tOFF(EN) DISABLED ENABLED (S1 ON) OUTPUT 2V/DIV. 100ns/DIV ENABLE DRIVE 2V/DIV.
90%
FIGURE 7B. MEASUREMENT POINTS FIGURE 7. ENABLE DELAYS
FIGURE 7C. WAVEFORMS
12
HI-506, HI-507, HI-508, HI-509 Typical Performance Curves
4 INPUT LOGIC THRESHOLD (V) (VS), (VD) OFF ISOLATION (dB)
TA = 25oC, VSUPPLY = 15V, VAH = 2.4V, VAL = 0.8V, Unless Otherwise Specified
100
3
80
RL = 1K
60 RL = 10M 40
2
1
20
VEN = 0V CLOAD = 28pF VS = 7VRMS 105 106 FREQUENCY (Hz) 107
0 6 8 10 12 14 16 POWER SUPPLY VOLTAGE (V) 18 20
0 104
FIGURE 8. LOGIC THRESHOLD vs POWER SUPPLY VOLTAGE
FIGURE 9. OFF ISOLATION vs FREQUENCY
3 POWER SUPPLY CURRENT (mA) POWER SUPPLY CURRENT (mA)
3
2 VEN = 2.4V VEN = 0V 1
2
EN = 5V
1 EN = 0V
0 -55
-35
-15
-5 25 45 65 TEMPERATURE (oC)
85
105
125
0 -55
-35
-15
-5 25 45 65 TEMPERATURE (oC)
85
105
125
FIGURE 10A. HI-506/HI-507
FIGURE 10B. HI-508/HI-509
FIGURE 10. POWER SUPPLY CURRENT vs TEMPERATURE
13
HI-506, HI-507, HI-508, HI-509 Die Characteristics
DIE DIMENSIONS: 129 mils x 82 mils METALLIZATION: Type: CuAl Thickness: 16kA 2kA SUBSTRATE POTENTIAL (NOTE): -VSUPPLY PASSIVATION: Type: Nitride/Silox Nitride Thickness: 3.5kA 1kA Silox Thickness: 12kA 2kA WORST CASE CURRENT DENSITY: 1.4 x 105 A/cm2 TRANSISTOR COUNT: 421 PROCESS: CMOS-DI
NOTE: The substrate appears resistive to the -VSUPPLY terminal, therefore it may be left floating (Insulating Die Mount) or it may be mounted on a conductor at -VSUPPLY potential.
Metallization Mask Layout
HI-506
EN A0 A1 A2 A3 GND EN A0 A1 A2 NC
HI-507
GND
IN 1
IN 9
IN 1A
IN 1B
IN 2
IN 10
IN 2A
IN 2B
IN 3
IN 11
IN 3A
IN 3B
IN 4
IN 12 IN 13
IN 4A
IN 4B IN 5B
IN 5
IN 5A
IN 6
IN 14 IN 15
IN 6A
IN 6B IN 7B
IN 7
IN 7A
IN 8
IN 16
IN 8A
IN 8B
-V OUT
+V
NC
-V OUT A
+V OUT B
14
HI-506, HI-507, HI-508, HI-509 Die Characteristics
DIE DIMENSIONS: 81.9 mils x 90.2 mils METALLIZATION: Type: CuAl Thickness: 16kA 2kA SUBSTRATE POTENTIAL (NOTE): -VSUPPLY PASSIVATION: Type: Nitride/Silox Nitride Thickness: 3.5kA 1kA Silox Thickness: 12kA 2kA WORST CASE CURRENT DENSITY: 1.4 x 105 A/cm2 TRANSISTOR COUNT: 234 PROCESS: CMOS-DI
NOTE: The substrate appears resistive to the -VSUPPLY terminal, therefore it may be left floating (Insulating Die Mount) or it may be mounted on a conductor at -VSUPPLY potential.
Metallization Mask Layout
HI-508
EN A0 A1 A2 GND EN A0 A1
HI-509
GND
-VSUP IN 1 IN 2
+VSUP IN 5
-VSUP IN 1A IN 2A
+VSUP IN 1B
IN 6
IN 2B
IN 3 IN 7 IN 4 OUT IN 8
IN 3A IN 3B IN 4A OUT A OUT B IN 4B
15
HI-506, HI-507, HI-508, HI-509 Dual-In-Line Plastic Packages (PDIP)
N E1 INDEX AREA 12 3 N/2
E8.3 (JEDEC MS-001-BA ISSUE D)
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE INCHES SYMBOL
-B-
MILLIMETERS MIN 0.39 2.93 0.356 1.15 0.204 9.01 0.13 7.62 6.10 MAX 5.33 4.95 0.558 1.77 0.355 10.16 8.25 7.11 NOTES 4 4 8, 10 5 5 6 5 6 7 4 9 Rev. 0 12/93
MIN 0.015 0.115 0.014 0.045 0.008 0.355 0.005 0.300 0.240
MAX 0.210 0.195 0.022 0.070 0.014 0.400 0.325 0.280
-AD BASE PLANE SEATING PLANE D1 B1 B 0.010 (0.25) M D1 A1 A2 L A C L E
A A1 A2 B B1 C D D1 E
-C-
eA eC
C
e
C A BS
eB
NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
E1 e eA eB L N
0.100 BSC 0.300 BSC 0.115 8 0.430 0.150 -
2.54 BSC 7.62 BSC 10.92 3.81 8
2.93
16
HI-506, HI-507, HI-508, HI-509 Dual-In-Line Plastic Packages (PDIP)
N E1 INDEX AREA 12 3 N/2 -B-AD BASE PLANE SEATING PLANE D1 B1 B 0.010 (0.25) M D1 A1 A2 L A C L E
E28.6 (JEDEC MS-001-BF ISSUE D)
28 LEAD NARROW BODY DUAL-IN-LINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 B B1 C D D1 E E1 e eA eB L N MIN 0.015 0.125 0.014 0.030 0.008 1.380 0.005 0.600 0.485 MAX 0.250 0.195 0.022 0.070 0.015 1.565 0.625 0.580 MILLIMETERS MIN 0.39 3.18 0.356 0.77 0.204 35.1 0.13 15.24 12.32 MAX 6.35 4.95 0.558 1.77 0.381 39.7 15.87 14.73 NOTES 4 4 8 5 5 6 5 6 7 4 9 Rev. 0 12/93
-C-
eA eC
C
e
C A BS
eB
NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
0.100 BSC 0.600 BSC 0.115 28 0.700 0.200
2.54 BSC 15.24 BSC 2.93 28 17.78 5.08
17
HI-506, HI-507, HI-508, HI-509 Small Outline Plastic Packages (SOIC)
N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45o H 0.25(0.010) M BM
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A
L
MILLIMETERS MIN 1.35 0.10 0.33 0.19 9.80 3.80 MAX 1.75 0.25 0.51 0.25 10.00 4.00 NOTES 9 3 4 5 6 7 8o Rev. 0 12/93
MIN 0.0532 0.0040 0.013 0.0075 0.3859 0.1497
MAX 0.0688 0.0098 0.020 0.0098 0.3937 0.1574
A1 B C D
A1 0.10(0.004) C
E e H h L N
e
B 0.25(0.010) M C AM BS
0.050 BSC 0.2284 0.0099 0.016 16 0o 8o 0.2440 0.0196 0.050
1.27 BSC 5.80 0.25 0.40 16 0o 6.20 0.50 1.27
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
18
HI-506, HI-507, HI-508, HI-509 Small Outline Plastic Packages (SOIC)
N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45o H 0.25(0.010) M BM
M28.3 (JEDEC MS-013-AE ISSUE C) 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES SYMBOL A A1
L
MILLIMETERS MIN 2.35 0.10 0.33 0.23 17.70 7.40 MAX 2.65 0.30 0.51 0.32 18.10 7.60 NOTES 9 3 4 5 6 7 8o Rev. 0 12/93
MIN 0.0926 0.0040 0.013 0.0091 0.6969 0.2914
MAX 0.1043 0.0118 0.0200 0.0125 0.7125 0.2992
B C D E
A1 0.10(0.004) C
e H h L N
0.05 BSC 0.394 0.01 0.016 28 0o 8o 0.419 0.029 0.050
1.27 BSC 10.00 0.25 0.40 28 0o 10.65 0.75 1.27
e
B 0.25(0.010) M C AM BS
NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
19
HI-506, HI-507, HI-508, HI-509 Plastic Leaded Chip Carrier Packages (PLCC)
0.042 (1.07) 0.048 (1.22) PIN (1) IDENTIFIER C L 0.042 (1.07) 0.056 (1.42) 0.050 (1.27) TP
N20.35 (JEDEC MS-018AA ISSUE A)
0.004 (0.10) C
20 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE INCHES SYMBOL A A1 MIN 0.165 0.090 0.385 0.350 0.141 0.385 0.350 0.141 20 MAX 0.180 0.120 0.395 0.356 0.169 0.395 0.356 0.169 MILLIMETERS MIN 4.20 2.29 9.78 8.89 3.59 9.78 8.89 3.59 20 MAX 4.57 3.04 10.03 9.04 4.29 10.03 9.04 4.29 NOTES 3 4, 5 3 4, 5 6 Rev. 2 11/97
0.025 (0.64) R 0.045 (1.14)
D2/E2 C L E1 E D2/E2 VIEW "A"
D D1 D2 E E1 E2 N
D1 D 0.020 (0.51) MAX 3 PLCS
A1 A
0.020 (0.51) MIN
SEATING -C- PLANE 0.026 (0.66) 0.032 (0.81) 0.013 (0.33) 0.021 (0.53)
0.045 (1.14) MIN
0.025 (0.64) MIN VIEW "A" TYP.
NOTES: 1. Controlling dimension: INCH. Converted millimeter dimensions are not necessarily exact. 2. Dimensions and tolerancing per ANSI Y14.5M-1982. 3. Dimensions D1 and E1 do not include mold protrusions. Allowable mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1 and E1 include mold mismatch and are measured at the extreme material condition at the body parting line. 4. To be measured at seating plane -C- contact point. 5. Centerline to be determined where center leads exit plastic body. 6. "N" is the number of terminal positions.
20
HI-506, HI-507, HI-508, HI-509 Plastic Leaded Chip Carrier Packages (PLCC)
0.042 (1.07) 0.048 (1.22) PIN (1) IDENTIFIER C L 0.042 (1.07) 0.056 (1.42) 0.050 (1.27) TP
N28.45 (JEDEC MS-018AB ISSUE A)
0.004 (0.10) C
28 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE INCHES SYMBOL A A1 MIN 0.165 0.090 0.485 0.450 0.191 0.485 0.450 0.191 28 MAX 0.180 0.120 0.495 0.456 0.219 0.495 0.456 0.219 MILLIMETERS MIN 4.20 2.29 12.32 11.43 4.86 12.32 11.43 4.86 28 MAX 4.57 3.04 12.57 11.58 5.56 12.57 11.58 5.56 NOTES 3 4, 5 3 4, 5 6 Rev. 2 11/97
0.025 (0.64) R 0.045 (1.14)
D2/E2 C L E1 E D2/E2 VIEW "A"
D D1 D2 E E1 E2 N
D1 D 0.020 (0.51) MAX 3 PLCS
A1 A
0.020 (0.51) MIN
SEATING -C- PLANE 0.026 (0.66) 0.032 (0.81) 0.013 (0.33) 0.021 (0.53)
0.045 (1.14) MIN
0.025 (0.64) MIN VIEW "A" TYP.
NOTES: 1. Controlling dimension: INCH. Converted millimeter dimensions are not necessarily exact. 2. Dimensions and tolerancing per ANSI Y14.5M-1982. 3. Dimensions D1 and E1 do not include mold protrusions. Allowable mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1 and E1 include mold mismatch and are measured at the extreme material condition at the body parting line. 4. To be measured at seating plane -C- contact point. 5. Centerline to be determined where center leads exit plastic body. 6. "N" is the number of terminal positions.
21
HI-506, HI-507, HI-508, HI-509 Ceramic Dual-In-Line Frit Seal Packages (CERDIP)
c1 -A-DBASE METAL E b1 M -Bbbb S BASE PLANE SEATING PLANE S1 b2 b ccc M C A - B S AA C A-B S D Q -CA L DS M (b) SECTION A-A (c) LEAD FINISH
F16.3 MIL-STD-1835 GDIP1-T16 (D-2, CONFIGURATION A)
16 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE INCHES SYMBOL A b b1 b2 b3 c MIN 0.014 0.014 0.045 0.023 0.008 0.008 0.220 MAX 0.200 0.026 0.023 0.065 0.045 0.018 0.015 0.840 0.310 MILLIMETERS MIN 0.36 0.36 1.14 0.58 0.20 0.20 5.59 MAX 5.08 0.66 0.58 1.65 1.14 0.46 0.38 21.34 7.87 NOTES 2 3 4 2 3 5 5 6 7 2, 3 8 Rev. 0 4/94
eA
c1 D E e eA eA/2 L Q S1
e
DS
eA/2
c
0.100 BSC 0.300 BSC 0.150 BSC 0.125 0.015 0.005 90o 16 0.200 0.060 105o 0.015 0.030 0.010 0.0015
2.54 BSC 7.62 BSC 3.81 BSC 3.18 0.38 0.13 90o 16 5.08 1.52 105o 0.38 0.76 0.25 0.038
aaa M C A - B S D S
NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer's identification shall not be used as a pin one identification mark. 2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. 4. Corner leads (1, N, N/2, and N/2+1) may be configured with a partial lead paddle. For this configuration dimension b3 replaces dimension b2. 5. This dimension allows for off-center lid, meniscus, and glass overrun. 6. Dimension Q shall be measured from the seating plane to the base plane. 7. Measure dimension S1 at all four corners. 8. N is the maximum number of terminal positions. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH.
aaa bbb ccc M N
22
HI-506, HI-507, HI-508, HI-509 Ceramic Dual-In-Line Frit Seal Packages (CERDIP)
c1 -A-DBASE METAL E b1 M -Bbbb S BASE PLANE SEATING PLANE S1 b2 b ccc M C A - B S AA C A-B S D Q -CA L DS M (b) SECTION A-A (c) LEAD FINISH
F28.6 MIL-STD-1835 GDIP1-T28 (D-10, CONFIGURATION A)
28 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE INCHES SYMBOL A b b1 b2 b3 c MIN 0.014 0.014 0.045 0.023 0.008 0.008 0.500 MAX 0.232 0.026 0.023 0.065 0.045 0.018 0.015 1.490 0.610 MILLIMETERS MIN 0.36 0.36 1.14 0.58 0.20 0.20 12.70 MAX 5.92 0.66 0.58 1.65 1.14 0.46 0.38 37.85 15.49 NOTES 2 3 4 2 3 5 5 6 7 2, 3 8 Rev. 0 4/94
eA
c1 D E e eA eA/2 L Q S1
e
DS
eA/2
c
0.100 BSC 0.600 BSC 0.300 BSC 0.125 0.015 0.005 90o 28 0.200 0.060 105o 0.015 0.030 0.010 0.0015
2.54 BSC 15.24 BSC 7.62 BSC 3.18 0.38 0.13 90o 28 5.08 1.52 105o 0.38 0.76 0.25 0.038
aaa M C A - B S D S
NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer's identification shall not be used as a pin one identification mark. 2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. 4. Corner leads (1, N, N/2, and N/2+1) may be configured with a partial lead paddle. For this configuration dimension b3 replaces dimension b2. 5. This dimension allows for off-center lid, meniscus, and glass overrun. 6. Dimension Q shall be measured from the seating plane to the base plane. 7. Measure dimension S1 at all four corners. 8. N is the maximum number of terminal positions. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH.
aaa bbb ccc M N
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (407) 724-7000 FAX: (407) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029
23

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